Electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus

ABSTRACT

The present invention includes an electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus. One embodiment of an electronic device workpiece processing apparatus includes a chuck including a surface, an electrical coupling adjacent the surface, and electrical interconnect configured to connect with the electrical coupling of the chuck and conduct a signal within the chuck; an intermediate member having a first surface and a second surface and the intermediate member including: an electrical coupling adjacent the first surface and configured to couple with the electrical coupling of the chuck; an electrical coupling adjacent the second surface; and an electrical interconnect configured to connect the electrical coupling adjacent the first surface and the electrical coupling adjacent the second surface; and an electronic device workpiece configured to couple with the second surface of the intermediate member, the electronic device workpiece including a sensor and an electrical coupling configured to provide electrical connection of the sensor with the electrical coupling of the second surface of the intermediate member.

TECHNICAL FIELD

The present invention relates to an electronic device workpieceprocessing apparatus and method of communicating signals within anelectronic device workpiece processing apparatus.

BACKGROUND OF THE INVENTION

It is preferred in the semiconductor and related arts to utilize largewafers for fabrication of integrated circuits and other devices. Largewafers are preferred inasmuch as an increased number of chips can befabricated from larger workpieces. As the size of the wafers continuesto increase as processing techniques are improved, additional processingobstacles are presented.

For example, it is typically preferred to provide a substantiallyuniform temperature across the surface of wafers being processed becausechanges in temperature can influence device fabrication. Wafers ofincreased diameters and surface areas experience increased temperaturefluctuations at various locations on the workpiece. In particular, apartial vacuum is typically used to pull small diameter wafers intodirect thermal contact with a hot plate. Such processing methodsfacilitate substrate temperature control because the substratetemperature is closely associated to the temperature of the hot plate.Fabrication of small sub-micron devices upon larger diametersemiconductor wafers or workpieces requires minimal backsidecontamination. As such, contact of the workpiece with the hot plate isnot typically possible. Large workpieces are processed in conventionaloperations upon spacers or pins that position the workpieceapproximately 0.1 millimeters above the hot plate surface. Such spacingintermediate a chuck or hot plate and the workpiece can result intemperature fluctuations across the surface of the workpiece.

The utilization of specific materials for processing large workpieces insmall geometry applications presents numerous obstacles. Absoluteworkpiece temperature and workpiece temperature uniformity areparameters which are closely monitored during wafer and workpiecefabrication to provide critical dimension (CD) control. Chemicallyamplified resists are often utilized in deep ultraviolet (DUV)lithography in small micron geometries (eg., 0.25 microns and below).Chemically amplified resists are particularly temperature dependentfurther increasing the importance of temperature control and monitoring.Some thermal resist processing steps require process windows rangingfrom 1-2 degrees centigrade down to a few tenths of a degree centigrade.Meteorology that is four to ten times more precise than conventionalprocess equipment is typically utilized to provide thermal performancemeasurements to 0.1 degrees centigrade.

One approach has disclosed the use of temperature sensors across asurface of the wafer to provide temperature mapping of the workpieceduring processing. Platinum foil and copper leads are utilized toelectrically connect the temperature sensors. With the use of numeroustemperature sensors across an entire workpiece surface, numerous wiresare required for coupling and monitoring. Such numerous wiredconnections can break and/or adversely impact processing of theworkpiece or the temperature measurements taken of the surface of theworkpiece. Some temperature sensors require four leads per sensorfurther impacting the processing and temperature monitoring of theworkpieces.

An improved method of providing temperature information is disclosed inU.S. patent application Ser. No. 09/032,184, entitled “Electronic DeviceWorkpieces, Methods of Semiconductor Processing and Methods of SensingTemperature of an Electronic Device Workpiece”, filed Feb. 27, 1998,naming Dr. Salman Akram and David R. Hembree as inventors, assigned tothe assignee hereof, and incorporated herein by reference.

There exists a need to provide additional improvements for monitoring ofprocessing of workpieces.

SUMMARY OF THE INVENTION

The invention provides electronic device workpiece processingapparatuses, and methods of communicating signals within an electronicdevice workpiece processing apparatus. Exemplary electronic deviceworkpieces include production workpieces (e.g., silicon wafers) andcalibration wafers.

One aspect of the invention provides an electronic device workpieceprocessing apparatus including a chuck, intermediate member and anelectronic device workpiece. The chuck includes an electricalinterconnect configured to conduct signals within the chuck. Theintermediate member is configured to conduct signals intermediateopposing surfaces of the intermediate member. The electronic deviceworkpiece includes one or more sensors. An exemplary sensor comprises aresistance temperature device (RTD) configured to provide processsignals containing process information regarding the electronic deviceworkpiece processing apparatus. A data gathering device or recorder canbe provided to record process information generated by the electronicdevice workpiece processing apparatus. The chuck and intermediate memberare configured to communicate the process signals intermediate thesensor and the data gathering device.

According to another aspect of the invention, an electronic deviceworkpiece processing apparatus includes a workpiece holder. Exemplaryworkpiece holders include a chuck and an intermediate member. Theworkpiece holder is adapted to receive an electronic device workpieceand includes an electrical coupling configured to electrically couplewith an electrical coupling of a received electronic device workpiece.The workpiece holder is adapted for communication of signals between theelectronic device workpiece and the workpiece holder.

The present invention also provides methods of communicating signalswithin an electronic device workpiece processing apparatus. According toone method, a workpiece holder is coupled with an electronic deviceworkpiece and a signal can be communicated through the workpiece holder.The communicated signals preferably contain process information.

Another aspect of the invention provides a method comprisingelectrically coupling a sensor of an electronic device workpiece with aworkpiece holder configured to receive the workpiece. The workpieceholder is configured to communicate signals generated using the sensor.

Yet another aspect of the present invention provides a method comprisingcommunicating signals intermediate circuitry of an electronic deviceworkpiece and circuitry of a workpiece holder configured to receive theelectronic device workpiece.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

FIG. 1 is an isometric view illustrating one embodiment of an electronicdevice workpiece processing apparatus.

FIG. 2 is a cross-sectional view taken along line 2—2 of the electronicdevice workpiece processing apparatus of FIG. 1.

FIG. 3 is a cross-sectional view of another embodiment of an electronicdevice workpiece processing apparatus.

FIG. 4 is an isometric view of a pogo plug of the chuck depicted in FIG.3.

FIG. 5 is an isometric view of the chuck depicted in FIG. 3.

FIG. 6 is a cross-sectional view of another embodiment of an electronicdevice workpiece processing apparatus.

FIG. 7 is a cross-sectional view of a sensor configuration of anelectronic device workpiece.

FIG. 8 is a cross-sectional view of another sensor configuration of anelectronic device workpiece.

FIG. 9 is a cross-sectional view of one embodiment of an electricalinterconnect within a chuck of an electronic device workpiece processingapparatus.

FIG. 10 is a cross-sectional view of the electrical interconnect of

FIG. 9 coupled with a calibration workpiece.

FIG. 11 is a cross-sectional view of another embodiment of an electricalinterconnect of a chuck.

FIG. 12 is a cross-sectional view of yet another embodiment of anelectrical interconnect of a chuck.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of theconstitutional purposes of the U.S. Patent Laws “to promote the progressof science and useful arts” (Article 1, Section 8).

Referring to FIG. 1, an embodiment of an electronic device workpieceprocessing apparatus 10 is illustrated. The depicted apparatus 10includes a workpiece holder 12 adapted to couple with or receive anelectronic device workpiece 20. Exemplary workpiece holders 12 include achuck 40 as shown in FIG. 1 and an intermediate member described below.Exemplary electronic device workpieces include calibration workpiecesand production workpieces.

Workpiece holder 12 includes an electrical coupling (not illustrated inFIG. 1) configured to electrically connect with an electrical couplingof electronic device workpiece 20. Connection of circuitry includingelectrical couplings of electronic device workpiece 20 and workpieceholder 12 permits communication of signals between electronic deviceworkpiece 20 and workpiece holder 12. Workpiece holder 12 is configuredto receive and conduct or communicate signals.

Electronic device workpiece 20 comprises a calibration workpiece in thepresently described embodiment. Production workpieces typically undergoprocessing from which subsequent devices are formed. Exemplaryproduction electronic device workpieces include semiconductor wafers,glass or quartz substrates for flat panel or field emission displaydevices, etc. Typical production workpieces are processed andsubsequently utilized to form products used in a variety of electronicdevices. Calibration and production electronic device workpieces cancomprise silicon, glass, quartz or other materials.

Workpiece holder 12 can be implemented in various configurations. In theembodiment depicted in FIG. 1, workpiece holder 12 is implemented as achuck 40. Chuck 40 is configured to receive electronic device workpiece20 and preferably compatible with processing of electronic deviceworkpiece 20.

In the depicted embodiment, electronic device workpiece 20 comprises acalibration workpiece. Workpiece 20 includes opposing surfaces 21, 22(only surface 21 is shown in FIG. 1). A plurality of sensors 23 areborne by or provided adjacent first surface 21 of workpiece 20. Sensors23 are configured to sense a process condition within apparatus 10 andgenerate and output process signals corresponding to the sensing.Exemplary process signals contain information regarding processing of aworkpiece.

The depicted sensors 23 comprise resistance temperature devices (RTD).The information within the process signals can comprise temperatureinformation corresponding to sensed temperatures at plural positionsacross surface 21 of workpiece 20.

In a preferred embodiment, sensors 23 comprising resistance temperaturedevices individually include plural electrical connections. Suchresistance temperature devices include four electrical connectionsproviding two connections for voltage monitoring and two connections forcurrent monitoring. This configuration provides cancellation orminimization of wire resistances of connections to sensors 23.

In the embodiment depicted in FIG. 1, chuck 40 is coupled with a datagathering device or data recorder 14. Data gathering device 14 isconfigured to couple with an electrical interconnect of chuck 40 andreceive process signals through chuck 40 outputted from plural sensors23 provided upon workpiece 20. One embodiment of data gathering device14 comprises a ClientPro MTR computer available from Micron Electronics,Inc. utilizing a Pentium™ processor.

Data gathering device 14 is configured to receive and process signalsprovided by sensors 23 and corresponding to processing conditions ofworkpiece 21. Alterations to processing conditions of apparatus 10 canbe changed responsive to reception of process signals within device 14.

Electronic device workpiece 20 is held by chuck 40 with the use of avacuum or mechanical coupling in exemplary embodiments. The depictedchuck 40 includes a lip 52 configured to receive and maintain electronicworkpiece device 20 in a desired position relative to chuck 40.

Referring to FIG. 2, the depicted chuck 40 includes a surface 39 and anopposing surface 41. Chuck 40 also includes circuitry comprising aplurality of electrical interconnects 44 and plural electrical couplings45 adjacent surface 41. Electrical interconnects 44 are configured toconnect with or include respective electrical couplings 45 of chuck 40.In addition, electrical interconnects 44 are configured to conduct orcommunicate signals within and through chuck 40. In the depictedembodiment, electrical interconnects 44 are configured to conduct orcommunicate signals intermediate surfaces 39, 41 of chuck 40.

The depicted electrical interconnects 44 comprise pogo pins which areavailable from Rika Denshi America, Inc. and have product designationRM-500 Series. Electrical interconnects 44 of other configurations canbe utilized.

Calibration workpiece 20 is shown received within chuck 40 in FIG. 2.Lip 52 is operable to define a compartment for reception of electronicdevice workpiece 20. Surfaces 21, 22 of electronic device workpiece 20are illustrated in FIG. 2. A plurality of sensors 23, such as resistancetemperature devices, are shown provided or fabricated upon surface 21 ofelectronic device workpiece 20. In the depicted embodiment, aninsulative protective layer 28 is shown formed over sensors 23. Layer 28can comprise glass or other suitable material for protecting sensors 23.

One exemplary electronic device workpiece 20 is described in the patentapplication having Ser. No. 09/032,184, filed Feb. 27, 1998, and citedabove. Such a workpiece 20 includes circuitry comprising electricalcouplings 24, vias 25 and connections 27 corresponding to respectivesensors 23.

Connections 27 comprise conductive traces in the described embodimentand are configured to couple sensors 23 with respective vias 25. Vias 25extend intermediate surfaces 21, 22 of electronic device workpiece 20.Vias 25 preferably include a conductive material to electrically couplesurfaces 21, 22 of workpiece 20. In a preferred embodiment, theconductive material in vias 25 is electrically isolated from electronicworkpiece 20. For example, an insulator or dielectric layer around thevia conductor can be utilized.

Electrical couplings 24 are adjacent or borne by surface 22 ofelectronic device workpiece 20. Electrical couplings 24 comprise bond orland pads of electronic device workpiece 20 and correspond to respectivesensors 23 and vias 25. Further, electrical couplings 24 are preferablyconfigured to provide electrical connection of sensors 23 withelectrical couplings of chuck 40 and an intermediate member (ifprovided) as described below.

Electrical couplings 45 are spring loaded and configured to protrudeslightly above surface 41 of chuck 40. Electrical couplings 45 of chuck40 are configured or adapted to couple with electrical couplings 24 ofelectronic device workpiece 20. Positioning or reception of electronicdevice workpiece 20 upon chuck 40 slightly depresses electricalcouplings 45 of pogo pins or electrical interconnects 44 in thedescribed embodiment. Electrical connection is established intermediateelectrical couplings 24 of device 20 and electrical couplings 45 ofchuck 40.

Following connection of electrical couplings 24, 45, process signalsfrom data gathering device 14 can be applied to sensors 23 via wire 13,electrical interconnect 44, electrical couplings 24, 45 and connections25, 27. In addition, signals outputted from sensors 23 can be conductedvia connections 25, 27, electrical couplings 24, 45, electricalinterconnect 44, and wire 13 to data gathering device 14. The depictedpogo pins are configured to remain within chuck 40 during normalproduction use or processing of production electronic device workpiecesin one embodiment of the invention.

Workpiece holder 12, as depicted in FIG. 2, includes a plurality ofvacuum channels or chambers 49 extending intermediate surfaces 39, 41.Vacuum chambers 49 are coupled with a vacuum source 51 in a preferredembodiment. Vacuum chambers 49 are configured to receive a vacuum tocouple a received electronic device workpiece 20 with workpiece holder12. Mechanical devices such as clamps are utilized in other embodimentsto attach or couple workpiece 20 with workpiece holder 12.

Following coupling of the circuitry of calibration workpiece 20 with thecircuitry of workpiece holder 12, process signals can be communicatedintermediate sensors 23 and data gathering device 14. Thereafter, thecoupling of respective circuitry of workpiece 20 and workpiece holder 12can be broken and another calibration workpiece or production workpiececan be coupled with workpiece holder 12.

Referring to FIG. 3, an alternative embodiment of electronic deviceworkpiece processing apparatus 10 is illustrated. The depictedprocessing apparatus 10 includes a workpiece holder 12 comprising aninsert or intermediate member 60. Intermediate member 60 is alsoreferred to as an insert or interposer. The depicted intermediate member60 is adapted to couple with chuck 40, and receive and couple withelectronic device workpiece 20. Intermediate member 60 is preferablyconfigured to communicate signals intermediate chuck 40 and electronicdevice workpiece 20.

Intermediate member 60 preferably comprises a nonconductive materialwhich is compatible with a fabrication environment. Intermediate member60 includes opposing surfaces 61, 62 and circuitry comprising at leastone electrical interconnect 64 and plural electrical couplings 65, 66.Electrical interconnect 64 is configured to electrically couple opposingsurfaces 61, 62 of intermediate member 60. In addition, electricalinterconnect 64 is configured to couple circuitry of workpiece 20 andcircuitry of chuck 40. Surface 61 of intermediate member 60 isconfigured to face a received electronic device workpiece 20. Surface 62of intermediate member 60 is configured to face chuck 40 duringprocessing of electronic device workpieces 20.

Intermediate member 60 is configured to receive electronic deviceworkpiece 20 having electrical couplings 24. In addition, intermediatemember 60 is configured to couple with chuck 40 having electricalcouplings 45. Electrical interconnects 64 are configured to electricallyconnect electrical couplings 24 of electronic device workpiece 20 withelectrical couplings 45 of chuck 40. The depicted electricalinterconnects 64 comprise double-ended probes or pogo pins which arealso available from Rika Denshi America, Inc. and have productdesignation B1052 Series Probes. Other suitable probes include B1080-C3Low Profile Probes and the B1303-C3 or B1316-C3 Ball Grid Probes.Electrical interconnects 64 of other configurations can be utilized.

The depicted intermediate member includes a lip 63 configured to receiveelectronic device workpiece 20. Chuck 40 includes lip 52 configured toreceive intermediate member 60.

In the depicted embodiment, mechanical devices such as clamps can beutilized to couple or maintain electronic device workpiece 20 withsurface 61 of intermediate member 60. Further, a vacuum is utilized inthe illustrated embodiment to couple intermediate member 60 with chuck40. The depicted chuck 40 includes plural chuck vacuum channels orchambers 49. Vacuum channels 49 are in fluid communication with openings53 at surface 41 of chuck 40. Vacuum channels or chambers 49 areconfigured to couple with a vacuum source 51 and receive a vacuum tocouple intermediate member 60 relative to chuck 40. In otherembodiments, intermediate member 60 is received and maintained withinchuck 40 by mechanical fasteners such as clamps. In addition, a vacuumcan be utilized in other arrangements to couple workpiece 20 withintermediate member 60.

An alternative configuration of intermediate member 60 includesutilization of a copper filmipolyamide tape having conductive microbumpsto provide electrical connection of sensors 23 and electrical couplings45 of chuck 40. An exemplary tape is available from Nitto Denko America,Inc.

Referring to FIGS. 3 and 4, the depicted chuck 40 includes a pluralityof electrical couplings 45. Electrical couplings 45 are embodied as pogoplugs 47 in the presently described embodiment. The depicted pogo plugs47 individually include an insulator 50 provided about conductiveelectrical coupling 45. Exemplary materials of insulator 50 includeplastic, glass, ceramic, Teflon, and Torlon. Pogo plugs 47 can beprovided within a plurality of vias 48 formed within chuck 40. Wires 13are connected with electrical couplings 45 of pogo plugs 47 and datagathering device 14.

Referring to FIG. 5, details of chuck 40 are illustrated. Electricalcouplings 45 are shown adjacent surface 41 of chuck 40. Insulators 50 ofpogo plugs 47 are shown to isolate conductive electrical couplings 45from chuck 40. In addition, openings 53 of vacuum channels or chambers49 are visible within surface 41. Lip 52 surrounds the periphery ofchuck 40 in the illustrated embodiment and is configured to receiveintermediate member 60 as previously described.

Referring again to FIG. 3, reception of electronic device workpiece 20upon surface 61 of intermediate member 60 slightly depresses electricalcouplings 65 of pogo pins 64 establishing an electrical connectionintermediate electrical couplings 24, 65. Similarly, placement ofintermediate member 60 within chuck 40 slightly depresses electricalcouplings 66 of pogo pins 64 establishing electrical conductionintermediate electrical couplings 45, 66.

In the described embodiment, intermediate member 60 is configured totemporarily receive electronic device workpiece 20. Following processingof electronic device workpiece 20, workpiece 20 can be removed fromintermediate member 60. Also, chuck 40 is configured to temporarilyreceive intermediate member 60 in the described embodiment. Followingproduction or processing of electronic device workpieces 20,intermediate member 60 can be removed from chuck 40.

One advantage of the embodiment described with reference to FIG. 3, isthe provision of a clean production chuck 40 having no moving parts. Inaddition, chuck 40 is isolated to a greater extent from the processingenvironment utilized to fabricate or process electronic deviceworkpieces 20. Utilization of intermediate member 60 provides processingof electronic device workpiece 20 apart from chuck 40. Such minimizesexposure of chuck 40 to processing materials utilized during fabricationprocesses.

According to one processing methodology, calibration workpiece 20 isreceived within intermediate member 60, and intermediate member 60placed upon chuck 40. Following sensing of process conditions usingsensors 23, calibration workpiece 20 is removed from intermediate member60. Thereafter, production electronic device workpieces are individuallyplaced within intermediate member 60 and processing of such workpiecesoccurs in mass.

Referring to FIG. 6, another embodiment of an electronic workpieceprocessing apparatus 10 according to the present invention isillustrated. Workpiece holder 12 depicted in FIG. 6 comprises a chuck 40configured to receive plural electronic device workpieces. Inparticular, chuck 40 is configured to receive a calibration workpiece 20and a production workpiece 80. Lip 52 of chuck 40 has been verticallyextended in the embodiment illustrated in FIG. 6 to accommodatereception of plural electronic device workpieces. Utilization of theconfiguration of apparatus 10 of FIG. 6 enables processing of productionworkpieces 80 while monitoring processing conditions using calibrationworkpiece 20.

Calibration workpiece 20 includes plural sensors 23 and correspondingconnections 25, 27 and electrical coupling 24 although only oneconstruction is labelled as such in FIG. 6. The calibration workpiece 20illustrated in FIG. 6 additionally includes plural through holes orvacuum chambers 26 passing intermediate surfaces 21, 22. Plural throughholes 26 are preferably provided within calibration workpiece 20although only one such through hole is illustrated in FIG. 6.

The depicted chuck 40 comprises plural vacuum channels or chambers 49,55 intermediate surfaces 39, 41 of chuck 40. Vacuum channels or chambers49 allow application of a vacuum to calibration workpiece 20 which pullscalibration workpiece 20 toward chuck 40. Vacuum chambers 55 and throughholes 26 permit application of a vacuum to production workpiece 80 whichpulls production workpiece 80 toward calibration workpiece 20 and chuck40.

In particular, vacuum channels or chambers 49, 55 are configured tocouple with an external vacuum source 51 at positions adjacent surface39 of chuck 40. Vacuum source 51 is configured to provide a calibrationwafer hold-down vacuum to chamber 54 using a supply line 56. Inaddition, the illustrated vacuum source 51 is configured to provide aproduction wafer hold-down vacuum to vacuum channel or chambers 26, 55and production wafer 80 via connection 57. As illustrated, through holes26 of calibration wafer 20 are configured to align with vacuum chambers55 of chuck 40. Application of hold-down vacuums to channels or chambers26, 49, 55 operate to couple the respective calibration workpiece 20 andproduction workpiece 80 with chuck 40.

In an alternative embodiment, mechanical devices are utilized to couplecalibration workpiece 20 and production workpiece 80 with chuck 40.

The depicted chuck 40 includes an electrical interconnect 44 and anelectrical coupling 45 configured to meet or couple with electricalcoupling 24 of calibration workpiece 20. In the depicted arrangement,electrical interconnect 44 comprises a pogo pin. Wire connection 13operates to couple electrical interconnect 44 with data gathering device14. In the depicted embodiment, electrical interconnect 44 comprisescircuitry configured to conduct process signals within chuck 40 andintermediate surfaces 39, 41. Data gathering device 14 is configured toreceive the process signals from sensors 23 through chuck 40 andintermediate member 60.

Referring to FIG. 7, an exemplary portion of a calibration workpiece 20is illustrated. Sensor 23 comprising a resistance temperature device isshown provided upon surface 21 of calibration workpiece 20. Via 25 isformed within calibration workpiece 20 intermediate surfaces 21, 22. Via25 is conductive to permit communication of process signals. Electricalconnection 27 is illustrated connecting sensor 23 and via 25. In thedepicted embodiment, electrical connection 27 comprises a conductivetrace.

An insulative dielectric layer 30 is provided about via conductor 25 insome configurations. Provision of dielectric layer 30 is preferred ifworkpiece 20 is semiconductive or conductive. Layer 30 is typically notutilized if workpiece 20 comprises a non-conductive material, such asglass.

In the preferred embodiment, a conformal protection layer 28 is providedover surface 21, sensor 23 and connection 27. Layer 28 operates toprotect surface 21, sensor 23 and electrical connection 27 from theprocessing environment including gasses, chemicals, plasmas, etc.utilized during processing of the electronic device workpieces. In thedescribed embodiment, layer 28 comprises glass. The glass may besputtered over calibration workpiece 20 including sensors 23, electricalconnections 27 and surface 21.

Referring to FIG. 8, a thick protection layer 28 is shown provided oversensors 23 and electrical connection 27. Layer 28 is preferablychemically or mechanically polished providing a flat or smooth surface29 of layer 28. A polished or flat smooth surface 29 of layer 28facilitates vacuum sealing of a production workpiece 80 placed overcalibration workpiece 20. In addition, flat smooth surface 29 providesenhanced wearing properties during processing of production workpieces80 or exposure of calibration workpiece 20 to process conditions. A wornor damaged glass layer 28 may be reprocessed to add more glass orresurfaced to remove defects within the existing glass layer.

Referring to FIG. 9, a portion of another embodiment of chuck 40configured to receive a calibration workpiece (not illustrated in FIG.9) is depicted. Through hole 42 is shown passing intermediate surfaces39, 41 of chuck 40. Plural through holes 42 are preferably provided inchuck 40 although only one such through hole is illustrated in FIG. 9.An insulative layer (not illustrated in FIG. 9) is preferably providedif chuck 40 comprises a conductive material. In particular, aninsulative layer can be provided about interconnect 44 or along thesurface of through hole 42 to electrically isolate interconnect 44 fromchuck 40. Such an insulative layer is not typically utilized if chuck 40is non-conductive.

Electrical interconnect 44 comprises a conductive column or wire in theembodiment depicted in FIG. 9. In particular, the depicted electricalinterconnect 44 comprises a buckle beam or column wire contact.Electrical interconnect 44 is provided within through hole or via 42.Electrical interconnect 44 includes electrical couplings 45, 46 whichare configured to extend outward from respective surfaces 39, 41 ofchuck 40 as shown. Column electrical interconnect 44 is configured toprovide electrical coupling with sensors 23.

A contact plate 90 is shown adjacent chuck 40 in FIG. 9. Contact plate90 includes circuitry 95 configured to provide electrical connectionwith electrical couplings 46 of chuck 40. Contact plate 90 includes aland pad or electrical coupling 94 configured for electrical connectionwith electrical coupling 46 of column interconnect 44. Electricalcontact plate 90 can comprise a printed circuit board (PCB), ceramicthick/thin film circuit board in exemplary embodiments. Circuitry 95provides electrical connection intermediate surfaces 91, 96 of contactplate 90. Circuitry 95 is coupled with connection 13 and data gatheringdevice 14.

Referring to FIG. 10, an electronic device workpiece comprising acalibration wafer 20 is shown contacting surface 41 of chuck 40. Inaddition, chuck 40 is shown contacting contact plate 90. As illustrated,placement of calibration workpiece 20 upon chuck 40 and chuck 40 uponplate 90 deflects conductive column 44. In particular, the originalposition P of conductive column 44 is represented by a dashed line inFIG. 10. Placement of calibration workpiece 20 upon chuck 40 and chuck40 upon contact plate 90 results in deflection of conductive column 44to the illustrated position P′ in FIG. 10.

In the illustration of FIG. 10, electrical couplings 45, 46 are providedin a conductive relationship with respective electrical couplings 24, 94of calibration workpiece 20 and contact plate 90 respectively. Throughhole 84 is preferably sized to provide electrical isolation ofconductive column interconnect 44 from chuck 40 when conductive column44 is deflected as shown in FIG. 10. In particular, chuck 40 cancomprise a material 43 which is conductive in some embodiments. Spacingconductive column 44 from material 43 of chuck 40 provides electricalinsulation or isolation of process signals passing through conductivecolumn electrical interconnect 44 from chuck 40.

In another embodiment, conductive wire interconnect 44 is fixed viaelectrical coupling 46 to electrical coupling 94 of contact plate 90.Electrical coupling 45 of conductive column 44 can thereafter be free tocouple with electrical coupling 24 of calibration workpiece 20.

Referring to FIG. 11, another configuration having conductive column 44fixed to chuck 40 at an intermediate location of through hole 84 isillustrated. Both ends of conductive column 44 comprise respectiveelectrical couplings 45, 46 configured to move or deflect responsive tocoupling with external pads or electrical couplings. In the depictedembodiment, a securing device 88 is formed within through hole 84 to fixconductive column 44 at the approximately middle portion of through hole84. In exemplary embodiments, securing device 88 comprises epoxy pressfit as a disk or plug into through hole 84. In another embodiment,through hole 84 is filled with epoxy which is subsequently machined toform securing device 88. Securing device 88 is preferably non-conductiveif chuck 40 comprises a conductive material.

Referring to FIG. 12, an alternative configuration is shown providing anencapsulated conductive column wire 44 within through hole 84. Anelectrically insulating encapsulating material 97, such as an elastomer,can be utilized to encapsulate conductive column 44. Such is preferredwherein chuck 40 comprises a conductive material 43. Encapsulation ofconductive column interconnect 44 is utilized to hold conductive columnwire 44 within through hole 84 and isolate conductive column 44 fromchuck 40. Utilization of an encapsulating material 97 encloses throughhole 84 of chuck 40 thereby reducing exposure of chuck 40 tocontaminating materials present during processing of electronic deviceworkpieces by apparatus 10.

Other electrical connections can be utilized within chuck 40 andintermediate member 60 of electronic workpiece device processingapparatus 10 in other embodiments. Exemplary connections include ShortContact™ connections available from Johnstech International Corporationand conventional socket type contacts (e.g., spring fingers). Otheruseable contacts include coil spring, leaf spring and probe needle typecontacts and contacts available from Interconnect Devices, Inc.Microspring™ contacts available from FormFactor, Inc. may also beutilized. Other exemplary contacts or pins are described in U.S. Pat.No. 5,495,667, incorporated herein by reference. Further, pins can beplaced upon land pads of an electronic device workpiece and configuredfor mating receipt within sockets provided upon chuck 40 or intermediatemember 60 of apparatus 10.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

What is claimed is:
 1. A method of communicating signals within anelectronic device workpiece processing apparatus, the method comprising:providing a workpiece holder; providing an electronic device workpieceincluding a sensor; electrically coupling the sensor of the electronicdevice workpiece with the workpiece holder; sensing a process conditionusing the sensor; generating a signal using the sensor responsive to thesensing; and conducting the signal through the workpiece holderfollowing the coupling.
 2. The method according to claim 1, wherein thecoupling comprises coupling circuitry of the electronic device workpiecewith circuitry of the workpiece holder.
 3. The method according to claim1 further comprising breaking the coupling of the sensor and theworkpiece holder.
 4. The method according to claim 1 further comprisingreceiving the electronic device workpiece within the workpiece holder.5. The method according to claim 1 wherein the coupling comprisescoupling using an intermediate member.
 6. The method according to claim1 wherein the providing a workpiece holder comprises providing a chuckconfigured to receive an electronic device workpiece.
 7. The methodaccording to claim 1 wherein the sensing comprises sensing the processcondition comprising temperature.
 8. The method according to claim 1wherein the sensing comprises sensing the process condition of theelectronic device workpiece.
 9. The method according to claim 1 furthercomprising supporting the electronic device workpiece using theworkpiece holder.
 10. The method according to claim 1 wherein thesensing comprises sensing the process condition regarding processing ofelectronic device workpieces within the electronic device workpieceprocessing apparatus.
 11. The method according to claim 1 wherein thesensing comprises sensing the process condition at a locationimmediately adjacent the electronic device workpiece within theelectronic device workpiece processing apparatus.